RA120 M
Features and Benefits
- Flawless mirror edges
- Ideal separation along precise crystal planes
- Unprecedented accuracy and repeatability
- User-friendly control of edge, skip or continuous scribes
- SUSS quality, reliability and support
Diamond scribing is the technique of choice for separating compound semiconductor wafers and substrates into individual chips, producing narrow separation lines with negligible material loss and low thermal and mechanical stressing of the substrate. The SUSS RA120 M is unsurpassed in providing the flexibility and precision required for this complex application.
