Overview
| Wafer size up to |
3” Ø |
| Substrate size up to |
3” x 3” (except MJB3 Standard: 2” x 2”) |
| Wafer / substrate thickness |
0 – 4.5 mm |
| Mask size up to |
4” x 4” |
| Exposure Modes |
|
Vacuum contact (except MJB3 Standard) |
|
Hard contact & soft contact |
| Exposure optics |
|
Standard 280 – 450 nm (200W mercury lamp) |
|
UV400 350 – 450 nm (350W mercury lamp) |
|
UV300 280 – 350 nm (350W mercury lamp) |
|
UV250 240 – 260 nm (500W Hg-Xe, PMMA resist) |
|
UV200 210 – 230 nm (350W Cd-Xe, PMMA resist) |
|
UV249 249 nm (KrF excimer laser) |
|
UV193 193 nm (ArF excimer laser) |
| Uniformity |
|
± 3% (2“ Ø ) (MJB3 Standard ± 5%) |
|
± 5% (3“ Ø ) (MJB3 Standard ± 10%) |
| Maximum exposure area |
|
3” x 3” (MJB3 Standard 3” Ø ) |
| Microscopes |
| Microscope manipulator range of movement |
50 x 50 mm |
| SUSS M200 SP |
| Splitfield Microscope |
|
| Objective distance, adjustable |
24 – 91 mm |
| Optional |
15 – 120 mm |
| Illumination |
Fiberoptic, 20W or 85W |
| SUSS M230 SP |
| Splitfield Microscope |
|
| Objective distance, adjustable |
30 – 91 mm |
| Illumination |
Fiberoptic, 85W |
| SUSS M400 |
| Normal Field Microscope |
|
| Illumination |
Direct 15W |
