Production Mask Aligner - MA25
Features and Benefits
- For sensors, power devices and micromachining
- Automatic cassette operation
- Wafers up to 125mm and substrates up to 4” x 4”
- First mask and subsequent alignment exposure modes
- Double-side exposure for wafer and substrates
| Exposure Technique | |
|---|---|
| Double-side | Upper mask: Proximity (Option) Lower mask: Soft contact |
| Single-side | Soft contact or proximity (Option) |
| Exposure System | |
| Standard spectral range | 350…450nm |
| Diffraction reducing optics, exposure area | 130mm dia. or 130mm x 130mm |
| Programmable exposure time | 0.1…100s |
| Two HG high-pressure lamps | 350W each, or 1000W each (Option) |
| Two lamp control units / supplies | 110V @ 60Hz or 220V @50Hz |
| SUSS Horizontal Split-Field Microscope | |
| Total magnification | 40x, 70x or 100x (Option) |
| Objective spacing, adjustable | 17…64mm, 26…85mm or 44…104mm (Option) |
| Collinear direct illumination | 85W |
| Oblique illumination | 85W |
| Transport System, Mask Holder | |
| Transport rail coating | Teflon (for wafers), Glass (for substrates) |
| Prealignment station, chuck and mask holder (alternatively) | for wafers up to 125mm dia. or for substrates up to 4” x 4” (Option) |
