Manual Mask Aligner - MJB4

Features and Benefits

  • High resolution manual mask aligner capable to print features of 0.5 µm
  • Wafer and substrate handling up to 4" (wafers), 4"x4" (substrates)
  • Special substrate chucks for pieces, III-V materials, thick substrates, hybrids and HF components
  • High precision X, Y, Q alignment stage and microscope manipulator
  • High intensity optical setups for different UV- exposure wavelengths up to 90mW/cm²
Overview
Substrate size 1” up to 100mm / 4” (round) 
  5 x 5mm up to 100 x 100mm / 4” x 4” (square) 
Wafer / Substrate thickness  Up to 4mm 
Mask size  2”x 2” up to 5” x 5” 
Mask thickness  Up to 4.8mm / 190mil 
Exposure system
Lamp house  350W 
Lamp power  200W, 350W, 500W (DUV with HgXe lamp) 
Intensity
(average over Ø 10mm area) 
200W    40mW/cm² at 405nm
              25mW/cm² at 365nm
  350W    80mW/cm² at 405nm
            45mW/cm² at 365nm
  500W    20mW/cm² at 250nm
Uniformity  ± 3% 
Lamp power supply
CPC (Standard)  Constant power controller for Hg200W or Hg350W 
CIC1200 Constant intensity controller for Hg200W, Hg350W & HgXe500W 
Alignment system
Top side alignment  M500 Singlefield microscope 
  M604 Splitfield microscope 
IR alignment  Double transmitted illumination / M500 / one IR camera 
  Single incident illumination / M500 / one IR camera 
  Double transmitted illumination / M604 / two IR camera 
  Single incident illumination / M604 / two IR camera 
M604 illumination options  Brightfield (standard), Dark field, Interference contrast