Overview
| Wafer size |
up to 200 mm |
| Substrate size |
up to 8” x 8” |
| Exposure modes |
| Proximity : |
|
| Alignment / Exposure distance |
0 – 999 µm (selectable in 1 µ m steps) |
| Soft contact : |
|
| Adjustable contact pressure |
0.03 – 0.07 N/cm² |
| Hard contact : |
|
| Adjustable contact pressure between chuck and wafer (using Nitrogen) |
0.04 – 0.16 N/cm² |
| Exposure system |
| Standard spectral range |
UV400: 350 – 450 nm |
| High collimation optics, Exposure area |
200 mm diameter or 8” x 8” |
| Intensity |
25 – 30 mW/cm² @ 405 nm |
|
15 – 20 mW/cm² @ 365 nm |
| Uniformity |
± 3% for 200 mm wafers |
|
± 5% for 8” x 8” substrates |
| Constant Intensity power supply CIC1000 |
|
