Production Mask Aligner - MA150

Features and Benefits

  • 6” high-performance production mask aligner
  • High throughput and high yield
  • PC control with plasma touch screen operation
  • Wafer size 2” up to 6”
Overview
Wafer size 3” – 150mm
Substrate size 3” x 3” – 6” x 6”
Exposure optics
UV400 350 – 450 nm Hg-Lamp 350W / 1000W
UV300 280 – 350 nm Hg-Lamp 350W / 1000W
UV250 240 – 260 nm Cd-Xe Lamp 350W
UV249 249 nm Excimer laser
UV193 193 nm Excimer laser
10W average power at 193 nm
7,5W average power at 193 nm
Stabilized
Uniformity (150 mm dia.) ± 5%
Exposure Modes
Proximity:
Alignment/ Exposure distance (selectable in 1 µm steps) 0 – 999 µm
Soft contact:
Adjustable contact pressure 0.03 – 0.07 N/cm²
Hard contact:
Adjustable contact pressure between chuck and wafer via nitrogen 0.04 – 0.16 N/cm²
Vacuum contact:
Max. diameter 150mm