Production Mask Aligner - MA1006
Features and Benefits
- From small pieces up to 6”
- State of the Art for low budget
- Very flexible, extremely robust
Overview
| Wafer size |
max. 150 mm Ø |
| Substrate size |
Max. 150 x 150 mm |
| Thickness |
0 –5 mm |
| Mask size |
max. 7” x 7” |
| Exposure optics |
| UV400: 350 nm – 450 nm |
Hg-lamp: 350W / 1000W |
| UV300: 280 nm – 350 nm |
Hg-lamp: 350W / 1000W |
| Uniformity |
± 5% for 150 mm wafers |
| Splitfield Video Camera system |
| Image storage system |
SUSS MicroTec DSS02 |
| Camera |
CCD 2/3” chip |
| Monitor |
Screen 10” – 15” |
| Optics |
| Zoom factor nom. |
5x 35x |
| Zoom factor visual - 14” monitor |
150x – 1000x |
| Exposure program |
| Proximity |
|
| Soft contact |
|
| Hard contact |
|
| Vacuum contact |
|
